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PT100MF1MP1
■ Manufacturing Guidelines
● Storage and Handling
1. Store these parts between 5°C and 30°C, at a relative humidity of less than 70 % .
2. After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than
60 % , and mount the parts within two days.
3. When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry
box or by resealing the parts in a moisture-proof bag with a desiccant.
4. When baking the parts before mounting, Sharp recommends no more than one incidence of baking, performed
with the parts either temporarily mounted or on a metal tray. Do not bake the parts in the carrier tape. Bake the
parts at 125°C, for 16 to 24 hours.
● Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A01601EN
7
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